Blog – Freelance Hardware Engineer | Expert in PCB, Schematic, & Digital Circuit Design

High-Performance Measurement Instrument

Project Title: Development of High-Frequency Boards with Advanced FPGA Integration for CMX Measurement Instrument

Objective: Design and develop two front-end TRX boards for a CMX measurement instrument, tailored for general telecommunication protocols and specialized 5G measurements, incorporating both analog and digital circuits with advanced FPGA integration.

Key Responsibilities and Achievements:

Requirement Analysis and Design Strategy:

Conducted a thorough analysis of stakeholder requirements to define the full scope of functionalities needed for the TRX boards.

FPGA Selection and Block Diagram Design:

Designed the block diagram for the TRX boards, focusing on the selection of an FPGA that met the specific criteria for gigabit transceivers and speed capabilities.
Conducted extensive evaluations and power simulations to select an FPGA that supported the high-speed inter-board digital communication required for the project.

Schematic Design and Simulation:

Created detailed schematics using Zuken CR8000 Designer, translating the conceptual design into precise circuit diagrams.
Followed datasheet recommendations and conducted simulations in LTspice to verify critical circuit parts, such as LVDS termination and I2C protocol bandwidth, ensuring signal integrity and impedance control.
Collaborated with layout engineers and utilized PCB Toolkit software for accurate impedance calculations.

Component Validation and Testing:

Validated newly integrated circuits, including DC-DC converters and eFuses, through rigorous measurements to ensure their performance and reliability within the design.
Developed and executed a comprehensive electrical testing protocol, utilizing high-speed oscilloscopes and probes to test gigabit transceivers, measure eye diagrams, jitter, and signal integrity.

High-Speed Communication and Signal Integrity:

Ensured proper functionality of high-speed communication interfaces by design and testing, focusing on minimizing signal degradation and ensuring protocol robustness.
Employed specialized software packages for high-speed communication testing to verify reference clocks and overall signal integrity.

Outcome:

Successfully developed circuitry of Xilinx FPGA for high-performance boards with complex tailored for both general telecommunication and 5G measurements. This project showcased my ability to manage complex hardware designs, from requirement analysis through schematic design and testing, resulting in a sophisticated and high-performance solution for the measurement instrument.

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SerDes Logging Adapter

High-Speed Communication Interface Development for Compact SerDes Logging Adapter

Project Title: Development of a Compact, High-Speed SerDes Logging Adapter with Optimized Signal Integrity and Thermal Management

Objective: Design and develop a compact SerDes Logging Adapter, ensuring high-speed communication reliability, effective thermal management, and seamless integration with existing systems, particularly focusing on Serializer and Deserializer components.

Key Responsibilities and Achievements:

Component Verification and Testing:

Established direct communication with suppliers to acquire development boards for Serializer and Deserializer components.
Conducted detailed testing focusing on data link stability, range, current and voltage capabilities, and thermal performance, ensuring components met required specifications and performed reliably under operational conditions.

Compact Design and Thermal Management:

Led discussions with project management and mechanical engineering teams to achieve a compact form factor (as small as a cigarette box) while accommodating power-hungry components like FPGA, SerDes chips, Ethernet controllers, and 8-channel connectors.
Conducted power calculations and optimized component placement to enhance passive cooling and minimize heat concentration.

PCB Design and Signal Integrity:

Utilized Altium Designer for schematic creation and LTspice for circuit simulation, ensuring accurate representation and functionality under various conditions.
Employed PCB Toolkit software to calculate impedance control parameters, maintaining signal integrity and reliability across high-speed communication interfaces.

High-Speed Communication Optimization:

Optimized PCB layout for high-speed communication protocols (up to 6 Gbps) including RGMII, MIPI CSI-2, SPI, and I2C.
Implemented impedance matching and noise filtering strategies to ensure minimal signal degradation, jitter, and error-free data transmission.

Hardware Bring-Up and Testing:

Developed a robust electrical testing protocol, using high-speed oscilloscopes and probes to capture performance metrics like eye diagrams and jitter for evaluating digital signal quality.
Created detailed heat maps using thermal imaging tools to identify and optimize hot spots on the PCB.

Electromagnetic Compatibility (EMC) Enhancements:

Addressed EMC challenges by rerouting clock signals, revising decoupling capacitor placements, and minimizing parasitic inductance, significantly reducing noise and interference.
Improved the design by shielding critical signals and optimizing the PCB layout to meet stringent EMC requirements.

On-Site Integration and Customer Collaboration:

Travelled to the customer’s site for the initial bring-up of the SerDes Logging Adapter, making intricate adjustments to optimize performance.
Developed configuration scripts to streamline SLA settings for various operational conditions, ensuring seamless integration with the customer’s system.

Outcome:

Successfully developed a compact and robust SerDes Logging Adapter, achieving reliable high-speed communication, effective thermal management, and compliance with EMC standards. The project demonstrated my ability to handle complex hardware challenges, collaborate across teams, and deliver a high-performance product ready for real-world applications.

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Electronic Control Unit: Cost-Optimized Hardware Development

Project Title: Development of Cost-Effective Electronic Control Unit

Objective: Design and develop a door control unit, ensuring optimal performance, reliability, and cost-efficiency while adhering to automotive safety standards.

Key Responsibilities and Achievements:

Schematic Design and Component Selection:

Developed a block diagram using MS Vision to structure the entire electronic system.
Conducted a detailed Trade-off analysis in Excel to select key components, focusing on cost and availability, reliability and performance, protection and thermal constraints.

Testing and Verification:

Facilitated direct communication with suppliers to acquire development boards and rigorously tested each component under controlled conditions using digital DC electric loads, oscilloscopes, and thermal cameras.
Collaborated with software and system engineering teams to ensure seamless integration of the chosen components with the software and system functionalities.

PCB Design and Simulation:

Designed the PCB using Altium Designer and validated the circuit’s performance through LTspice simulations, ensuring optimal circuit functionality.
Selected high-performance FR4 laminate suitable for automotive applications, focusing on thermal reliability.

Signal and Power Integrity:

Calculated impedance control parameters using PCB Toolkit software to maintain signal quality across digital communication buses.
Analyzed power distribution across the PCB to prevent voltage drops and overheating,
Designed circuit ensuring compliance with ISO 26262 and ISO 7637 automotive standards.

Cost Optimization:

Responded to market changes prompted by COVID-19 by integrating cost-down ideas into the design, reducing hardware costs by approximately 35% without compromising functionality.
Reduced the PCB layer count from eight to six layers by simplifying the schematic and optimizing component placement.

Compiled essential documentation, including a worst-case analyses, standardized hardware design checklist, MTBF calculations, RoHS conformity checks, and manufacturing files.

Project Management and Collaboration:

Managed the hardware development process, organizing weekly coordination meetings using Atlassian Jira tools.
Aligned hardware development with software integrations and system requirements, avoiding potential delays.
Documented testing outcomes and system requirements using IBM DOORS, leading iterative improvements in the hardware design.

Final Documentation and Transition to Production:

Organized review sessions and secured approvals for all deliverables, ensuring a seamless transition to mass production.

Outcome:

Successfully developed a robust and cost-effective door control unit, meeting stringent automotive standards and achieving a significant cost reduction, while ensuring the system’s reliability and performance for the robo-taxi application. The project demonstrated my ability to integrate advanced hardware engineering techniques, manage cross-functional teams, and deliver high-quality solutions within budget.

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